CONNECT WITH US

Chinese OSATs gear up for advanced packaging

Staff reporter, Taipei; Rodney Chan, DIGITIMES Asia 0

Credit: JCET

Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services to capitalize on the AI chip boom, according to industry sources.

The article requires paid subscription. Subscribe Now