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Wednesday 26 June 2024
Japanese, South Korean, and Taiwanese semiconductor supply chain firms will get SelectTalentUSA help
Finally, foreign semiconductor companies investing to produce chips in the United States are getting the help they need to recruit local talent for their supply chain.
Wednesday 26 June 2024
Challenges to Singapore's semiconductor surge: high costs, limited space and regional rivalries
Singapore is attracting major semiconductor investments, thanks to its strong labor force, advanced research capabilities, and solid manufacturing infrastructure.
Wednesday 26 June 2024
Phison to boost PCIe Gen5 retimer chip shipments
Phison Electronics began delivering its PCIe Gen5 retimer chips in January and has since stepped up the pace of shipments, according to the Taiwan-based company.
Wednesday 26 June 2024
ASE sees better prospects in 2H24, thanks to robust advanced packaging demand
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand created by new applications including Artificial Intelligence (AI), robots, electric vehicles, energy and the Internet of Things (IoT).
Wednesday 26 June 2024
Passive component companies expand production for AI demand
Companies across industries, including the passive component sector, are optimistic about generative AI's business potential.
Wednesday 26 June 2024
Poland's CEZAMAT supports the nation's photonics prowess and wider European chip ambitions
One of the largest high-tech R&D investment projects in Poland, the Centre for Advanced Materials and Technology (CEZAMAT) under the Warsaw University of Technology has been a pillar underpinning the semiconductor ambitions of Poland, especially the country's vibrant photonics ecosystem. Apart from the Warsaw University of Technology as consortium leader, CEZAMAT also includes Poland's Military University of Technologies, the University of Warsaw, and various institutes under the Polish Academy of Sciences.
Wednesday 26 June 2024
Apple's unique bets on M-Series chips for AI servers
Unlike other major tech companies that heavily rely on Nvidia GPUs for training and inference tasks of Large Language Models (LLM), Apple's Apple Intelligence server chips are unique. They utilize Apple's self-developed Apple Silicon, with multiple reports indicating the use of M-series chips.
Wednesday 26 June 2024
Sumitomo Chemical downsizes LCD materials, scales up investment in semiconductor materials
Japan-based Sumitomo Chemical is refining its growth strategy by downsizing its LCD component business while expanding its semiconductor materials division.
Wednesday 26 June 2024
SK Hynix thrives in HBM market while Samsung awaits Nvidia certification
SK Hynix's performance outlook in the High Bandwidth Memory (HBM) market has garnered optimism from South Korea's securities industry, driven by major customer orders from NVIDIA, AMD, and others.
Wednesday 26 June 2024
Malaysia fast becoming semiconductor hub
Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.
Wednesday 26 June 2024
ASE sets up new facility in southern Taiwan for advanced packaging
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build a new facility dubbed K28 in Kaohsiung, southern Taiwan.
Tuesday 25 June 2024
Xi urges China to combat rivals' tech dominance during chip battle with US
President Xi Jinping called on China to step up innovation because other countries dominate certain key technologies, comments that underscore his nation's escalating semiconductor confrontation with the US.
Tuesday 25 June 2024
Intel Foundry ecosystem partners add reference flows for EMIB advanced packaging
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect Bridge (EMIB) advanced packaging technology.
Tuesday 25 June 2024
Samsung to resume P5 construction as AI surges memory demand
To address the rising memory demand of the AI boom, Samsung is resuming the construction of its new Pyeongtaek plant 5 (P5), with construction beginning as early as the third quarter of 2024 and completion estimated by April 2027.
Tuesday 25 June 2024
SK keyfoundry unveils breakthrough in GaN technology
According to PR Newswire and Evertiq, SK keyfoundry has announced that it has secured key device characteristics for a 650V GaN High Electron Mobility Transistor (HEMT).
Tuesday 25 June 2024
Taiwan OSATs to see sales growth in 2H24
Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half of 2024, according to sources from the upstream supply chain.
Monday 24 June 2024
ByteDance and Broadcom in talks to develop advanced AI chip
ByteDance Ltd. and Broadcom Inc. have discussed a potential collaboration on an AI processor to help bolster the TikTok parent's development of that technology.
Monday 24 June 2024
Intel Foundry's 3nm process is catching up fast, should Samsung worry about it?
Samsung and Intel are trying to overtake TSMC, but TSMC chairman C. C. Wei's answer to that challenge is: "No way!"
Monday 24 June 2024
Former TSMC R&D director Konrad Young advocates Taiwan-UK collaboration in quantum tech
Konrad Young, a pivotal figure in semiconductor research known for his leadership at TSMC told DIGITIMES Asia during his UK visit that quantum computing presents a prime opportunity for Taiwan and the UK to collaborate.
Monday 24 June 2024
OmniVision expects CIS opportunities in AI PC, automotive, and machine vision
Despite plateauing smartphone demands, OmniVision expects rising demands for CMOS Image Sensors (CIS) in AI PCs, automotive, and machine vision applications, says OmniVision.
Monday 24 June 2024
General DRAM production rate remains modest at 80 percent
As the industry heavily invests in High Bandwidth Memory (HBM) DRAM, market insiders predicted a supply shortage for general DRAM.
Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics, and Intel in the advanced packaging field.
Monday 24 June 2024
South Korean manufacturers rumored to consider 'full liquidation' of old equipment
Even since the US imposed sanctions on China, South Korean manufacturers have been storing old equipment in warehouses, incurring annual rental fees exceeding KRW20 billion (approx. US$14.6 million).
Monday 24 June 2024
Weekly news roundup: pre-orders for Copilot+ PC collaborated by Microsoft, Qualcomm exceed expectations
These are the most-read DIGITIMES Asia stories in the week of June 17 – June 21.
Monday 24 June 2024
Taiwan Fertilizer's triple Focus: clean energy, eco-friendly fertilizers, and semiconductor solutions
Taiwan Fertilizer, the island's largest ammonia supplier, has inaugurated its Advanced Business Research Center at its Miaoli plant, marking a significant pivot towards clean energy.
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