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NEWS TAGGED TFME
Friday 21 June 2024
Chinese OSATs gear up for advanced packaging
Chinese OSATs including Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics (TFME) have stepped up their deployments for advanced packaging, offering services...
Wednesday 3 January 2024
Chinese chip firms' valuations outperform local market in 2023; equipment shines
China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
Tuesday 19 December 2023
Why would China send GPUs to Malaysia for advanced packaging?
A Reuters report quoted three people familiar with the fact that more and more Chinese IC design houses are having their chips packaged in Malaysia, worrying that the US...
Thursday 24 August 2023
China bets on chiplet technology to match 14/7nm performance
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
Tuesday 15 August 2023
JCET, Tongfu and Huawei partaking Chinese effort to strengthen chiplet technology
Former TSMC COO, Chiang Shang-yi, currently the chief strategy officer at Foxconn semiconductors, faced challenges when he returned to China's SMIC in December 2020. He encountered...
Friday 30 June 2023
China OSATs see ramp-up orders from local DDI players
China-based OSATs, including Chipmore Technology and Tongfu Microelectronics (TFME), have seen orders from the local display driver IC (DDI) sector ramp up recently, according to...
Friday 16 June 2023
AMD backend partners gearing up for new processors
TSMC, ASE Technology and Tongfu Microelectronics (TFME), as well as test interface specialists WinWay Technology and Chunghwa Precision Test Tech (CHPT) are all gearing up for shipments...
Monday 12 June 2023
China-based Tongfu Microelectronics underpins AMD's new MI300 APU
While front-end manufacturing and back-end assembling and testing of NVIDIA's next-generation AI chips are handled by TSMC and Taiwan-based packaging and testing companies, China-based...
Friday 28 April 2023
Malaysia needs at least one medium-size wafer foundry fab, says MSIA president
Malaysia should strive to attract investors to set up at least one medium-size wafer foundry fab to build a complete semiconductor manufacturing supply chain in the country, not just...
Thursday 27 April 2023
AMD partner, China-based packaging leader Tongfu Micro reported Q1 2023 results
Leading Chinese IC assembly and testing player Tonfgu Microelectronics has revealed its first-quarter 2023 results, seeing a revenue of CNY4.64 billion (US$670 million), up 3.11%...
Thursday 30 March 2023
China-based Tongfu Micro became world's fourth-largest OSAT player in 2022
Tongfu Microelectronics, a major IC assembly and testing company in China, has posted sales that grew by 35.52% but saw profit drop by 47.53% amid the macroeconomic challenges and...
Monday 27 March 2023
AMD's AI strategy to drive OSAT sales in China and Taiwan
As Nvidia founder Jensen Huang observed the "iPhone moment for AI", AMD has also strengthened its role in artificial intelligence (AI). The GPU/CPU provider has reportedly set up...
Friday 9 December 2022
ASML undaunted by Dutch export controls?
The Dutch government has succumbed to Washington's pressures, despite earlier comments from Dutch Foreign Trade Minister Liesje Schreinemacher that the Netherlands would not "copy...
Friday 21 October 2022
China OSATs see capacity utilization rates plummet
China-based OSATs including JCET, Tianshui Huatian Technology and Tongfu Microelectronics have seen their capacity utilization rates plummet since the fourth quarter of 2022, due...
Monday 22 August 2022
AMD seen not to hike prices for mainstream core chips for PCs
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...