Fan-out panel level packaging (FOPLP) offers advantages in cost control, high-density integration, and high reliability. After years of research and development, the technology has matured and its scope of application has gradually expanded beyond vehicle-mounted applications. It has become a critical packaging process for next-generation RFIC used for low earth orbit satellites. Robert Lin, General Manager of Manz Taiwan, stated that the FOPLP market demand will quickly expand as the number of success stories increases. Manz Taiwan has worked on these solutions for years. It has developed several innovative technologies and established comprehensive service mechanisms and professional teams to facilitate joint development with IDM OSAT (outsourced semiconductor assembly and test), Display panel, and IC substrate manufacturers to reduce the minimum requirements for production and commence mass production.
Manz Taiwan has strong roots in automation and has focused on the development of production equipment for displays, high-end IC substrates, and other high-tech electronics since its establishment. It has also developed FOPLP technologies in the last 10 years. Since 2015, the company has helped renowned companies in the domestic and foreign semiconductor industries with the production of the next-generation packaging process and accumulated strong innovation capabilities, particularly the equipment and plating processes for the FOPLP RDL wet fabrication process. It also introduced high-precision inkjet printing technologies and gained a leading position in the industry.
Robert Lin stated that the evenness of the coating in FOPLP RDL is critical for the performance of semiconductor components. Manz Taiwan optimized the FOPLP RDL plating process and increased the overall copper plating uniformity to 92%. It can also meet the requirements of certain categories of customers such as power semiconductor companies to increase the thickness of the coating to 100μm and increase the current used for plating to 5 ASD instead of the existing 1-2 ASD. It significantly increased the copper plating speed and doubled monthly output. Manz AG developed exclusive high-precision inkjet printing technologies and Manz Taiwan used them in the FOPLP process. The technology can be used for direct printing on functional conductor or intermediary materials to streamline the production process and enhance production efficiency.
Manz Taiwan offers customers the best support with comprehensive service mechanisms
In addition to innovative technologies, Manz Taiwan also provides comprehensive service mechanisms for technology validation and introduction. First, Manz Taiwan integrated partners and technologies to create one-stop process equipment solutions and ensure that customers can quickly commence mass production after the delivery of the equipment. The advantages of automation increase the synergy and performance of the entire process. Second, Manz Taiwan provides solutions and services for different FOPLP substrate materials including stainless, glass, and epoxy molding compounds (EMC) for customers to choose the most appropriate process solution based on their expertise.
Third, Manz Taiwan set up the RDL laboratory in Taiwan equipped with comprehensive advanced equipment for customers to conduct tests and validation during the technology development phase before verifying the feasibility of projects and transferring them to the actual production line. The laboratory thus reduces the minimum requirements for production and helps customers commence mass production.
After the laboratory was established, domestic and foreign customers have used it for tests and validation of FOPLP process technologies. During the tests, the team at Manz Taiwan also provides technical services to help customers reduce the development time.
With regard to FOPLP development, Robert Lin believes that the technology has underwent concept communication, validation, and trial production and has entered the practical application phase. Applications have also expanded from vehicles to satellite communication, which verified its commercial value. Robert Lin stated that the demand for future FOPLP applications has risen faster than expected. Manz Taiwan has prepared robust technical capacities and comprehensive service mechanisms to help different customers adopt next-generation packaging technologies and win the next wave of market opportunities.
Robert Lin, General Manager of Manz Taiwan, stated that Manz Taiwan has worked on FOPLP solutions for years. It has developed several innovative technologies and established comprehensive service mechanisms and professional teams to help customers adopt new process technologies and win new business opportunities in the market.
