Research Report Database

REALTIME NEWS

Synopsys expected to provide automation and analytics tools for Tata Electronics chipmaking facilities in India

Micron poised to bet on high-efficiency HBM, more DRAM for AI phones

Honda launches N-VANe: budget BEV to compete with Chinese rivals

Electric Vehicles

AI servers drive cross-domain collaboration, redefining industry norms

Home Tech Semiconductors

Micron to run HBM packaging hub in Taiwan

Siu Han, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 5 September 2023 0

Akshay Singh, VP of advanced packaging technology development at Micron. Credit: DIGITIMES

Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Tomorrow's Headlines.
Asia Supply Chain 250 dataset access.

Research Report Database

Facilitating the developments of artificial intelligence, silicon proliferation, and software-defined systems, Synopsys enables pervasive intelligence innovation

Summary of Tech Supply Chain News!

TOP STORIES
7 DAYS NEWS