The US Department of Commerce on March 23 issued a validated end-user (VEU) license to TSMC Nanjing, replacing the previous temporary exemption given in October 2022, according to...

Since the turn of the century in the year 2000, the changes brought to the world by digital technology and the Internet can be roughly categorized into four phases. The first phase...

TSMC is scaling up its 3nm chip output, which in 2024 will be over three times that of 2023, according to Y. K. Hwang, company senior director for Fab 18B.

The global foundry industry's revenue declined about 5% sequentially but grew 12% year-on-year in the first quarter of 2024, according to Counterpoint Research.

Optical film packaging and CMOS image sensor (CIS) back-end manufacturer VisEra held its shareholder meeting and board of directors election on May 22.

In a recent LinkedIn post, ASML CEO Christophe Fouquet said that TSMC CEO C.C. Wei, along with other executives, paid a visit to ASML's Veldhoven headquarters last week.

ASML Holding NV and Taiwan Semiconductor Manufacturing Co. have ways to disable the world's most sophisticated chipmaking machines in the event that China invades Taiwan, according...

Many in the South Korean industry believe that with TSMC, the leading semiconductor foundry, facing increasing risks from earthquakes in Taiwan and unstable cross-strait relations,...

SK Hynix and TSMC have advanced their next-generation High-Bandwidth Memory (HBM) mass production plans.

There have been reports that Samsung Electronics' 3nm manufacturing process is ready and will be used on its newest Exynos flagship processor platform, which is expected to be released...

EDA giant Synopsys has completed the tape-out of a high-performance mobile SoC design using Samsung Electronics' 3nm GAA (Gate-All-Around) wafer foundry process. This chip is set...

TSMC has started producing Tesla's next-generation Dojo AI training tiles with its InFO_SoW (Integrated Fan-Out System-on-Wafer) technology, aiming for a 40x increase in computing...

Moore's Law is not advancing as fast as it used to be under 2nm and even into the Angstrom level, and competitors are trying to catch up. Can ASML, the Dutch semiconductor equipment...

Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...

An explosion from a chemical truck at Taiwan Semiconductor Manufacturing Co.'s construction site in Arizona killed the driver, according to statements from a local construction union...