Socionext has announced a partnership with Arm and TSMC to develop an innovative, power-optimized 32-core CPU chiplet in TSMC's 2nm silicon technology, enabling scalable performance for hyperscale data center servers, 5G and 6G infrastructure, DPU and edge-of-network device applications. The engineering samples are expected to be available in the first half of 2025.
This advanced CPU chiplet proof-of-concept, built with Arm Neoverse CSS technology, is intended for single or multiple instantiations within a single package, as well as IO and application-specific custom chiplets to optimize performance for a wide range of end applications.
Multiple target applications can be supported by leveraging CPU chiplets and customized application-specific chiplets, Socionext indicated. When new chiplets become available, a cost-effective package level upgrading option is possible.
Socionext develops custom SoCs for customers in the global hyperscale data center, automotive, and networking industries. "Driven by commercial and time-to-market benefits, there is a growing customer demand for granular compute power. Leveraging silicon re-use to create multiple product platforms enables innovative system architectures," said Hisato Yoshida, corporate EVP and head of global development at Socionext.
"With leading silicon node enablement and our partnership with Arm, we are designing and delivering highly integrated large scale silicon solutions to global customers," Yoshida continued. "This chiplet complements our customersʼ current SoC designs and provides system architects new degrees of freedom to deliver many platform variants for a product family."
"Arm Neoverse CSS is unlocking greater accessibility to custom silicon and driving innovation across the chiplet ecosystem," said Mohamed Awad, SVP and GM of infrastructure line of business at Arm. "The advanced chiplet proof-of-concept from Socionext is demonstrating what is possible through Arm Total Design and will accelerate the path to custom, workload-optimized solutions for our broader ecosystem."
"TSMC is pleased to support Socionext and Armʼs flexible chiplet design with the outstanding performance, form factor and energy efficiency offered by our 2nm technology, as well as our comprehensive ecosystem to accelerate time-to-market of customer product innovations," said Cliff Hou, SVP of corporate research and R&D at TSMC. "We have worked with Socionext across many generations of our leading-edge technology, and look forward to extending this collaboration into the 2nm generation."
