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Innolux, OSATs stepping up FOPLP deployment

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Asia Monday 24 June 2024 0

Credit: DIGITIMES

In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics, and Intel in the advanced packaging field.

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