H3C Technologies, owned by Tsinghua Unigroup and HPE, recently announced that it will collaborate with Foxconn to establish its first overseas factory in Malaysia.
BYD has stepped up its semiconductor business deployment, extending its Chengdu production location to add fab capacity for automotive chips, according to industry sources in China...
With the Biden administration's heightened export controls on semiconductor chips to China, the Chinese AI industry finds itself in a mixed picture of some rejoicing and others facing...
Tsinghua Unigroup, a China-based holding company, released a statement on September 25 saying that it plans to "terminate" the related procedures regarding important asset reorganization...
Chinese AI server leader H3C recently issued a press release stating that Intel CEO Pat Gelsinger and Chief Commercial Officer Christoph Schell visited the headquarters of Tsinghua...
Industry rumors stated that Tsinghua Unigroup could be taking over GlobalFoundries (GF)'s 12-inch wafer fab in Chengdu, China. In exchange, the Chengdu city government will be investing...
On December 16, the Foxconn group made a major announcement, stating that it will be selling its entire stake in China's Tsinghua Unigroup. Foxconn's sudden announcement has certainly...
The latest tough and expanded US restrictions on shipments to China of advanced chips manufacturing equipment, supercomputer chips and high-end AI and HPC chips will not only drastically...
Foxconn Industrial Internet's (FII) investment in Chinese tech firm Tsinghua Unigroup is in line with the long-term development needs of Foxconn Technology Group (Hon Hai), according...
Foxconn Industrial Internet (FII), a subsidiary of Foxconn Technology Group, has confirmed that it has invested CNY9.8 billion (US$146 million) in a holding company that will takeover...
Unic Memory Technology, a loss-laden storage business unit under China's Tsinghua Unigroup, will be dissolved as part of the group's efforts to restructure its organization, according...
Tsinghua Unigroup has signed a strategic alliance with memory module firm Shenzhen Longsys Electronics in a move to accelerate its ambition in the NAND flash sector.
ChipMOS Technologies (Shanghai) will target initially the memory chip market and make slow progress in expanding its target markets to include display driver ICs, according to SJ...
