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NEWS TAGGED 3D
Tuesday 25 June 2024
CCI to begin mass production of 3D VC cooling for customers in 2H24
Amid the hype for liquid cooling in the server industry, Nidec Chaun-Choung Technology (CCI) chairman Junichi Nagai notes that the company will release liquid cooling solutions for...
Tuesday 28 May 2024
Samsung eyes rolling out 1,000-layer 3D NAND by 2030 with new material
Samsung Electronics is keenly exploring "hafnia ferroelectrics" as a next-generation NAND flash material, with the hope that this new material will enable stacking over 1,000 layers...
Tuesday 28 May 2024
Samsung reportedly achieves technical breakthrough, stacking 3D DRAM to 16 layers
Samsung Electronics has successfully stacked the next-gen 3D DRAM to 16 layers, twice as many as its competitor Micron.
Tuesday 14 May 2024
Samsung said to skip 300+ layers and directly target 400+ to reclaim 3D NAND leadership
With the rise of Artificial Intelligence (AI), the NAND flash market is experiencing significant growth. This has reignited the competition between Samsung Electronics and SK Hynix...
Friday 3 May 2024
Macronix sees orders regain momentum
ROM and flash memory maker Macronix International stayed in the red in the first quarter of 2024 with net losses amounting to NT$1.08 billion (US$33.2 million). Nevertheless, the...
Tuesday 30 April 2024
Innolux takes significant strides in 3D chip packaging
Innolux signed an agreement with Japan-based Tech Extension Co. (TEX) and Tech Extension Taiwan Co. (TEX-T) to introduce next-generation 3D packaging technologies based on Bumpless...
Tuesday 23 April 2024
Innolux to showcase GenAI 3D printing; Other versatile display solutions
Innolux will showcase its Generative AI (GenAI) technologies at the 2024 Touch Taiwan, including a 3D printer with AI 3D imaging solutions and its "Chat-N-Go" AI Automated Guided...
Monday 25 March 2024
Samsung advances towards 500-layer 3D NAND with V11 development
Samsung Electronics is intensifying its efforts in developing next-generation 3D NAND Flash technology.
Thursday 14 March 2024
Server air cooling turning to 3D VC solutions for better efficiency, says DIGITIMES Research
With air cooling being the mainstream solution at data centers, 3D Vapor Chambers (VCs) have successfully broken through the theoretical heat dissipation limitations of air cooling...
Thursday 1 February 2024
Samsung's 3D DRAM R&D team sets foot in Silicon Valley
Samsung Electronics has set up a new memory research and development (R&D) organization to advance 3D DRAM technologies and secure competitiveness through technology differenti...
Tuesday 30 January 2024
LG Innotek is rumored to be the exclusive supplier of Vision Pro's 3D sensing module
LG Innotek is rumored to be the exclusive supplier of the 3D sensing module for Apple's Vision Pro.
Friday 26 January 2024
Intel reportedly to integrate Samsung's LPDDR5X in Lunar Lake CPU by 3D packaging
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Tuesday 28 November 2023
SKMP develops high-thickness KrF photoresist to enhance competitiveness of 3D NAND processes
SK Group's KRW40 billion (US$31 million) acquisition of Kumho Petrochemical's electronic material business in 2020 is bearing fruit. SK Materials Performance (SKMP), the new subsidiary...
Tuesday 28 November 2023
Healthcare Expo Taiwan - Wincomm with Brain Navi demo leading 3D brain navigation surgical robot
In 2023, Intel announced a new achievement on AI-empowered advancing precision medicine and Wincomm was invited to demonstrate AI-based brain surgical and GI endoscopy solutions to...
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.