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NEWS TAGGED OSE
Friday 3 May 2024
Global server market, 1Q 2024

Introduction

Thursday 25 January 2024
Phison's AI applications see adoption by Kingston and OSE
NAND flash controller manufacturer Phison Electronics has announced the successful implementation of its aiDAPTIV+ AOI service into the automated optical inspection (AOI) systems...
Monday 27 November 2023
OSE sees 2024 growth, thanks to NAND and AI servers
Orient Semiconductor Electronics, Ltd.(OSE), a matured logic IC and NAND Flash memory semiconductor packaging & testing service and electronic manufacturing service (EMS) provider,...
Tuesday 24 October 2023
Taiwan OSATs see partial fab utilization recovery
Several Taiwan-based OSATs, including ChipMOS Technologies, Lingsen Precision Industries, Orient Semiconductor Electronics (OSE), and Walton Advanced Engineering, have begun to see...
Friday 4 August 2023
Memory backend houses see influx of short lead-time orders
Memory backend specialists including Powertech Technology (PTI), ChipMOS Technologies and Orient Semiconductor Electronics (OSE) have received an influx of short lead-time orders...
Tuesday 25 July 2023
OSE sees EMS business bolstered by robust AI server demand
As inventory adjustments at semiconductor and electronics supply chains may persist into the fourth quarter of the year, many medium-sized OSATs are seeking different niches to bolster...
Friday 7 October 2022
Memory chips to see demand recover faster than logic ICs
Memory makers such as Micron Technology and Kioxia are expected to see their business operations undermined by sharp declines in end-market demand for consumer electronics devices...
Tuesday 27 September 2022
ASEH to see production utilization drop in 4Q22
ASE Technology Holding (ASEH), which operates its backend operations mainly in Kaohsiung, southern Taiwan, will see its fab utilization rates loosen slightly in the fourth quarter...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Thursday 2 June 2022
Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...
Tuesday 26 April 2022
ASE competing with leading foundries, IDMs in advanced packaging segment
With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...
Wednesday 30 March 2022
Smaller OSATs may cut quotes to win wirebonding orders in 2H22
A wirebonding capacity supply glut is arising from fast capacity expansions at OSATs, which may lead them to cut quotes in the second half of 2022 to bolster their capacity utilization,...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Thursday 13 January 2022
China OSATs to cut prices for MCU packaging in 1H22
China-based OSATs, including Jiangsu Changjiang Electronics Technology (JCET), plan to cut quotes for consumer MCU and other conventional chip packaging services in the first half...
Friday 3 December 2021
ASE obtains major orders for new Qualcomm mobile SoC
Taiwan's leading backend house ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have obtained major orders for processing Qualcomm's just-unveiled flagship...