Micron is expanding its HBM production capacity in the United States and exploring the possibility of manufacturing the product in Malaysia, which is driven by soaring global demand...
SK Hynix's contract liabilities saw a remarkable sequential increase of over 73% or KRW1.16 trillion (US$855 million) in the first quarter of 2024, sparking speculations that Nvidia...
TSMC is scaling up its 3nm chip output, which in 2024 will be over three times that of 2023, according to Y. K. Hwang, company senior director for Fab 18B.
Recently, Sravan Vanaparthy, Vice President of Industrial Power Division, Power Solutions Group (PSG) at On Semiconductor (Onsemi), had an exclusive interview with DIGITIMES Research...
Amid sluggish iPhone sales, Samsung Electronics and Chinese smartphone brands have begun to take advantage of this gap and expand their inventory of smartphones and OLEDs to seize...
ASE Technology Holding (ASEH) and other Taiwan-based IC backend houses are gearing up for a prosperous second half of 2024, stepping up their capacity expansion pace, according to...
Market rumors said Samsung Electronics and SK Hynix are planning to resume the capacity expansion plans at its Pyeongtaek and Cheongju fabs, which were put on hold during the previous...
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Chinese IC design companies have initiated price wars in saturated and highly competitive market categories, leading Taiwanese IC design houses to expedite their withdrawal from these...
The worldwide IC design industry is stable, however, there is a notable increase in wafer foundry manufacturing capacity, which may provide potential risks, according to foundry sources.
Taiwan-based E Ink Holdings (EIH), a provider of e-paper solutions, has launched a recruitment initiative to hire an additional 150 individuals for capacity expansion over the next...
