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Wednesday 26 June 2024
ASE sets up new facility in southern Taiwan for advanced packaging
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Tuesday 25 June 2024
Bosch drives future of automotive tech with Microsoft GenAI and Qualcomm HPC partnerships
Tier 1 automotive supplier Bosch is aggressively pursuing advancements in automotive electronic and electrical architecture.
Friday 21 June 2024
RISC-V's rapid growth and hurdles ahead: US-China tech tensions and ecosystem fragmentation
RISC-V, an open standard instruction set architecture, has garnered global attention due to its royalty-free nature and adaptability for custom hardware development.
Thursday 20 June 2024
Samsung Foundry raises HPC-related sales target by 2028
Samsung Electronics recently disclosed its foundry technology roadmap at the Samsung Foundry Forum 2024 in Silicon Valley.
Wednesday 19 June 2024
Optical processors: UK startup Lumai revolutionizes AI compute stack for next-level performance
Lumai, a spin out from the University of Oxford, was founded by a team with expertise in optics over two years ago, aiming to develop a new type of AI processor.
Thursday 13 June 2024
AI and HPC brings recovery, Zenitron remains prudent for 2H24
The AI wave is propelling the semiconductor industry towards new growth momentum. Besides companies directly supplying and manufacturing AI PCs and AI servers, IC distributors are...
Friday 7 June 2024
TSMC May revenue grows 30% YoY to NT$229.62 billion; Q2 targets within reach
Benefiting from the expanded orders from AI and High-Performance Computing (HPC) customers, TSMC's May 2024 revenue remained high at NT$229.62 billion (US$7 billion), a slight decrease...
Tuesday 4 June 2024
Laying groundwork for panel-level packaging processes, Manz deepens deployment in advanced semiconductor packaging blue ocean
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced...
Monday 3 June 2024
PCB maker Unimicron expects to benefit from 5G AI, and HPC in 2H24
Leading Taiwanese PCB manufacturer Unimicron held its shareholders' meeting.
Friday 31 May 2024
Yageo chairman: inventory adjustments have reached healthy level
The passive component giant Yageo held its shareholders' meeting on May 30. Founder and chairman Pierre Chen stated that current inventory adjustments have reached a healthy level...
Monday 27 May 2024
Generative AI fuels Nvidia chip sales, shifts Taiwan's export dynamics
Generative AI has ignited a boom in Nvidia chip sales, with DRAM manufacturers offering HBM products also seeing a surge in orders.
Friday 17 May 2024
Topco sees strong orders from Chinese foundries
Topco Scientific, a Taiwan-based semiconductor material distributor, has seen a significant increase in orders from Chinese foundries whose 12-inch fab utilization rates have risen...
Tuesday 14 May 2024
Semiconductor materials orders driven by advanced processes, packaging demand
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
Monday 13 May 2024
Semco accelerates glass substrate production, eyeing high demand in HPC and automotive applications
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...
Tuesday 7 May 2024
WinWay expects strong AI and HPC chip demand to drive growth in 2024
IC test interface specialist WinWay Technology is optimistic about its sales prospects for 2024, citing strong demand for AI and HPC chips.