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Thursday 20 June 2024
Server AI accelerator market and technology

Introduction

Friday 7 June 2024
AI-enabled PCs, smartphones with PIM technology on the horizon
Samsung Electronics and SK Hynix have been at the forefront of developing the Processing-In-Memory (PIM) technology in recent years. They are poised to integrate it into AI-enabled...
Thursday 25 April 2024
Performance, power consumption, memory bandwidth remain challenges, as chip makers eye AI opportunities
At the AI Expo Taiwan 2024, running from April 24–26 at the Taipei Expo Park, major chip companies offer their take on potential developments in cloud and edge AI technologies,...
Monday 15 January 2024
Wi-Fi 7 will bring more efficient bandwidth usage
The Wi-Fi 7 standard is officially set to be finalized in the first quarter of 2024 and IC design companies, including Broadcom, Qualcomm, MediaTek, and Realtek, are gearing up for...
Thursday 4 January 2024
CXL competition intensifies as SK Hynix and Samsung gear up for 2024 showdown
While artificial intelligence (AI) and machine learning (ML) are gaining popularity, the Compute Express Link (CXL) memory technology emerges as a crucial standard interface. South...
Tuesday 2 January 2024
Taiwanese memory vendors embrace GenAI wave with innovative edge-computing solutions
With the generative AI boom in full swing, the supply chain is shifting its focus to developing edge AI device applications. In 2024, AI PCs and smartphones will undergo market sales...
Tuesday 19 December 2023
Samsung targets CXL dominance amid HBM competition
SK Hynix currently holds a dominant position in high-bandwidth memory (HBM). However, Samsung Electronics is eyeing the next competitive frontier-- the new-generation memory technology,...
Wednesday 1 November 2023
Apple's M3 chip: Memory bandwidth shrinks, but capacity upgrades soar
Apple's latest M3 chip is a 3nm marvel that promises to further enhance processing speed, efficiency, and endurance. However, one notable change is the decrease in memory bandwidth,...
Wednesday 25 October 2023
Micron collaborates with Qualcomm to accelerate generative AI
Micron Technology has announced that production samples of its low-power double data rate 5X (LPDDR5X) memory, which the company claims is the industry's only 1-beta mobile-optimized...
Wednesday 25 October 2023
Samsung unveils new-gen memory solutions for GenAI applications
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Monday 23 October 2023
US chip ban on China believed to see diminishing marginal effects
The tightened chip trade ban newly imposed by the US has cast a substantial shadow over major Chinese AI chip makers, potentially blocking their access to advanced chip manufacturing...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Tuesday 5 September 2023
Micron to run HBM packaging hub in Taiwan
Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).
Friday 1 September 2023
China reportedly pursuing high bandwidth memory self-sufficiency
China is keen on attaining self-sufficiency in high bandwidth memory (HBM), with ChangXin Memory Technologies (CXMT) to be playing a leading role in the development of HBM, according...
Thursday 31 August 2023
Accton developing network switches for new-gen data centers
Accton Technology is working with customers to develop network switches that can effectively meet the network transmission speed and adaptability needs of next-generation data centers...