Backend house ChipMOS Technologies has made upward revisions to its capex for the second half of 2024 in response to strong demand for high-end Display Driver ICs (DDI), according...
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
Taiwan's top memory backend specialist Powertech Technology (PTI) has decided to sharply raise its capital expenditure for 2024 from the original NT$10 billion (US$307.22 million)...
ASE Technology Holding (ASEH) may boost its capex in 2024 due to increased spending on advanced packaging and testing capabilities. The Taiwan-based OSAT also does not rule out developing...
Microsoft reported strong quarterly results. The surge was driven by corporate demand for Microsoft's cloud and AI offerings, particularly Azure. Microsoft plans to ramp up Capex...
Google followed the paths of other cloud majors and introduced a proprietary data center chip to reduce its reliance on a few AI chipmakers like Nvidia, Intel, and AMD, which account...
As India progresses in its Make-in-India initiative, particularly regarding semiconductor manufacturing, experts believe it will enter a period when investment begins to pick up.
ODM Wistron Chairman Simon Lin stated the company set its capex for 2024 at US$14 billion, of which 50% would be invested in its Taiwan-based facilities where AI is the focus.
In response to its mid-term expansion strategy, Unimicron Technology has upped its capex goal for this year by NT$6.9 billion (US$218.8 million) to NT$24.2 billion, a nearly 40% increase,...
The latest EU data shows that China-based companies scaled up their R&D investments in recent years. Companies based in the US ramped up their capital expenditures (Capex) as...
US-sanctioned SMIC reported its first sales growth in four quarters. Its profit halved amid a semiconductor downturn, with utilization rates remaining low.
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...