Samsung and Intel are trying to overtake TSMC, but TSMC chairman C. C. Wei's answer to that challenge is: "No way!"

Samsung Electronics recently disclosed its foundry technology roadmap at the Samsung Foundry Forum 2024 in Silicon Valley.

Qualcomm is expected to benefit the most from bottlenecks that Samsung Electronics' foundry has been experiencing in its 3nm process yield, according to industry sources.

Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...

Samsung Electronics is actively expanding its partner alliance to strengthen its semiconductor packaging technology, seeking to compete with the world's leading foundry, TSMC, in...

Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something...

The competition for advanced process orders between Samsung Electronics and TSMC has long been a point of attention in the industry.

Many in the South Korean industry believe that with TSMC, the leading semiconductor foundry, facing increasing risks from earthquakes in Taiwan and unstable cross-strait relations,...

Counterpoint released the global foundry market share ranking for the fourth quarter of 2023, showing that TSMC maintained its leadership status with a 61% market share driven by...

The three major players in advanced chip manufacturing have secured CHIPS Act subsidies by promising to increase investments in fabrication facilities within the United States. With...

South Korean tech giant Samsung Electronics has received US$6.4 billion of US CHIPS Act direct funding and disclosed that it will increase its investments to US$40 billion to set...

After the Wall Street Journal reported that Samsung Electronics will double its investment in Taylor, Texas, the US Department of Commerce (DOC) announced granting US$6.6...

According to the restructured accounting model of Intel Foundry (IF), it has been seeing continuous operational losses for three consecutive years from 2021 to 2023, totaling US$5.1...

Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...

Samsung Electronics is actively expanding its 4nm foundry customers. It's reported that VisioNexT, a subsidiary of the Hanwha Group, will place orders with Samsung to manufacture...