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NEWS TAGGED ASE
Wednesday 26 June 2024
ASE sees better prospects in 2H24, thanks to robust advanced packaging demand
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
Wednesday 26 June 2024
ASE sets up new facility in southern Taiwan for advanced packaging
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
Monday 24 June 2024
Innolux, OSATs stepping up FOPLP deployment
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
Friday 7 June 2024
Supermicro, ASE, and CSI to establish Taiwan's first liquid cooling data center
The rapid growth of Artificial Intelligence (AI) and High-Performance Computing (HPC) is driving an urgent need for performance while grappling with high energy consumption.
Monday 13 May 2024
ASE expected to accelerate sales growth in 2H24
Leading IC packaging and testing company, ASE Technology Holding Co., Ltd. reported a revenue of NT$45.82 billion for April, showing a monthly increase of 0.3% and a year-on-year...
Wednesday 8 May 2024
IC backend houses raise 2024 capex
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
Monday 6 May 2024
Southeast Asia and Japan attract OSAT interest amid geopolitical diversification
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
Monday 29 April 2024
KYEC leaves China amid OSAT shift toward Southeast Asia
King Yuan Electronics (KYEC) decided to sell its assets in China, another Taiwan-based OSAT major leaving China, as the US-China geopolitical tensions are reshaping the OSAT indust...
Friday 26 April 2024
ASEH likely to raise 2024 capex; US production line possible
ASE Technology Holding (ASEH) may boost its capex in 2024 due to increased spending on advanced packaging and testing capabilities. The Taiwan-based OSAT also does not rule out developing...
Friday 26 April 2024
ASEH expects core backend biz to post growth in 2Q24
ASE Technology Holding (ASEH) expects its core IC Assembly, Testing, and Material (ATM) business to see sequential revenue growth in the second quarter of 2024.
Monday 22 April 2024
Advanced packaging still in short supply; production expansion spreading overseas
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Thursday 18 April 2024
IC backend firms to embrace strong 2H24
ASE Technology Holding (ASEH) and other Taiwan-based IC backend houses are gearing up for a prosperous second half of 2024, stepping up their capacity expansion pace, according to...
Monday 1 April 2024
AI will help OSAT players turn the corner, but what about electricity price hikes?
As we enter the second quarter, AI remains a focal point in the market. Nvidia, AMD, and Intel have successively released high-end chips, and with the gradual recovery of consumer...
Monday 25 March 2024
IC packaging and testing suppliers coping with electricity price hike
The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive...
Thursday 21 March 2024
ASE expands VIPack advanced packaging solutions for AI device apps
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...