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NEWS TAGGED HEAT DISSIPATION
Thursday 20 June 2024
LX Semicon's new CEO to shift focus to thermal substrate market over SiCs
South Korea's leading IC design company, LX Semicon, is reportedly downsizing its Silicon Carbide (SiC) semiconductor R&D operations.
Thursday 6 June 2024
Taiwan's GenAI ecosystem unrivaled for next decade, says former tech minister
Taiwan boasts a comprehensive Generative AI (GenAI) ecosystem, with deep deployments in AI chips, packaging, and heat dissipation technologies, and no other place in the world is...
Thursday 6 June 2024
LG Electronics cracks US data center cooling market amid AI boom
As the AI boom fuels a surge in US data center investments, the demand for efficient cooling systems is becoming increasingly critical. LG Electronics, seizing the opportunity, has...
Tuesday 30 April 2024
Water cooling demands to surge as Nvidia shows AI server TDP will continue rising
Nvidia's GTC 2024 has confirmed the architecture of AI GPU. However, the demand for water cooling is increasing along with the growth of computing power. Where 1,000 watts were deemed...
Tuesday 30 April 2024
Liquid and air cooling solutions for AI servers

Introduction

Tuesday 16 April 2024
AI server liquid cooling receives attention; 4 big challenges remain
Since the introduction of Nvidia's Blackwell processor platform, liquid-cooling heat dissipation has been seen as a trend in heat dissipation technology.
Wednesday 20 March 2024
Topco expects silicone and heat dissipation material demand to rise
Topco Technologies is optimistic about the demand for heat-dissipation materials and silicone.
Thursday 22 February 2024
Air cooling solutions for datacenter servers

Introduction

Wednesday 21 February 2024
Taiwan motor driver IC suppliers gearing up for heat dissipation boom
Taiwan-based motor driver IC suppliers are seeing a surge in demand for related motor driver chips as the need for heat dissipation in cloud servers and edge IT devices increases.
Wednesday 24 January 2024
CCL firm Ventec grows presence in car industry supply chain
Taiwan-based Ventec Electronics, which specializes in niche-market copper-clad laminates (CCL) and thermal materials, has effectively penetrated the automotive industry supply chai...
Thursday 11 January 2024
Microloops sees strong demand for AI cooling solutions
Thermal module manufacturer Microloops Company expressed optimism over its business outlook in 2024, anticipating a recovery in NB due to AI PC and discontinuation of Microsoft Windows...
Wednesday 3 January 2024
FineMat adjusts metal mask business and looks forward to growth in 2024
Plummeting OLED metal mask prices and the sluggish mobile phone market have made 2023 rough for FineMat Applied Materials. Still, the company is optimistic that the semiconductor...
Thursday 26 October 2023
Topoint targets AI, EV, satellite applications with advanced drilling solutions
Taiwan-based Topoint Technology, a major provider of PCB drills and drilling services, is accelerating the development of advanced PCB drilling technologies to better meet robust...
Friday 13 October 2023
Generative AI to drive silicon photonics CPO penetration in next-gen data center solutions
Generative AI has driven the demand for high-performance computing (HPC) and high-speed transmission, which in turn is adding development momentum to silicon photonics optical communication...
Tuesday 26 September 2023
Niching sees clear order visibility for heat sinks
Niching Industrial, a distributor of IC packaging materials, sees clear order visibility for heat sinks thanks to brisk demand for midrange and high-end logic IC packaging.